Electronic apparatus

ABSTRACT

An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 USC §119 to JapanesePatent Application No. 2014-34954 filed on Feb. 26, 2014, entitled“Electronic Apparatus”, the entirety of which is incorporated herein byreference.

FIELD

The present invention relates to an electronic apparatus, and moreparticularly to a cover panel of an electronic apparatus.

BACKGROUND

In the related art various techniques are proposed for providing coverpanels for displays of an electronic devices. These cover panels aresubject to breakage and other damage such as cracking and chipping.

SUMMARY

A panel provided on the surface of an electronic apparatus hasresistance to breakage.

For example, a sapphire panel is provided on an electronic apparatus. Anouter surface of the sapphire panel facing outwards from a case, and aninner surface faces inwards into the case, such that the case and thesapphire panel form a housing. A board, for example, a circuit board, isdisposed in the case. The board has a plurality of components that havevarying heights. A gap reduction member faces the plurality ofcomponents on the board, and has a plurality of steps of varying heightsthat correspond to the heights of the plurality of components on theboard. The gap reduction member is provided to reduce the number of gapswithin the housing. A reduced number of gaps within the housing reducesa possibility of breakage or chipping of the sapphire panel when a forceis applied to the outer surface of the sapphire panel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an example of an externalappearance of an electronic apparatus;

FIG. 2 is a front surface view illustrating an example of an externalappearance of an electronic apparatus;

FIG. 3 is a rear surface view illustrating an example of an externalappearance of an electronic apparatus;

FIG. 4 is a view illustrating an example cross-sectional structure of anelectronic apparatus;

FIG. 5 is an example of a plan view of a cover panel when seen from aninner surface side;

FIG. 6 is a view illustrating an example of an electrical configurationof an electronic apparatus;

FIG. 7 is a top view illustrating an example of a configuration of apiezoelectric vibrating element;

FIG. 8 is a side surface view illustrating an example of a configurationof a piezoelectric vibrating element;

FIG. 9 is a view illustrating an example of a state of a piezoelectricvibrating element;

FIG. 10 is a view illustrating an example of the state of apiezoelectric vibrating element;

FIG. 11 is a view for describing an air conduction sound and aconduction sound;

FIG. 12 is a view illustrating an example of a cross-sectional structureof an electronic apparatus;

FIG. 13 is a plan view illustrating an example of an internal structureof an electronic apparatus;

FIG. 14 is a cross-sectional view illustrating an example of an internalstructure of an electronic apparatus; and

FIG. 15 is a cross-sectional view illustrating an example of an internalstructure of an electronic apparatus.

DETAILED DESCRIPTION

<External Appearance of Electronic Apparatus>

FIGS. 1, 2 and 3 are examples of a perspective view, a front surfaceview, and a rear surface view, respectively, illustrating an externalappearance of an electronic apparatus 1. FIG. 4 is a view schematicallyillustrating a cross-sectional structure along line A-A of theelectronic apparatus 1 illustrated in FIG. 2. FIG. 5 is a rear surfaceview of a cover panel 2 included in the electronic apparatus 1. Apiezoelectric vibrating element 190 and a display panel 120 included inthe electronic apparatus 1 are installed on the cover panel 2illustrated in FIG. 5. The electronic apparatus 1 is, for example, amobile phone such as a smart phone.

As illustrated in FIGS. 1 to 4, the shape of the electronic apparatus 1is approximately a rectangular plate shape in a plan view. Theelectronic apparatus 1 includes a transparent, and or lighttransmissive, cover panel 2 which covers a display surface 120 a (seeFIG. 4) of the display panel 120 and a case 3 which supports the coverpanel 2.

The cover panel 2 is disposed on the surface of the electronic apparatus1, specifically, on the front surface of the electronic apparatus 1. Thecover panel 2 is arranged on a portion other than an edge area, forexample a peripheral edge, of the front surface of the electronicapparatus 1.

The cover panel 2 has, for example, a plate shape, and an approximatelyrectangular shape in a plan view. The cover panel 2 includes a firstsurface 20 constituting a portion of the front surface of the electronicapparatus 1 and a second surface 21 that is positioned on the oppositeside to the first surface 20 and faces the display surface 120 a of thedisplay panel 120. Hereinafter, the first surface 20 is also referred toas an “outer surface 20” and the second surface 21 is also referred toas an “inner surface 21.” In addition, the cover panel 2 may be a planepanel having a planar shape or a curved panel having a curved shape.

The cover panel 2 is made of, for example, sapphire. That is, the coverpanel 2 is a panel of a one-layer structure having a layer made ofsapphire which is disposed on the surface of the electronic apparatus 1.Here, sapphire refers to a single crystal containing alumina (Al₂O₃) asa main component, and a single crystal whose purity of Al₂O₃ isapproximately greater than or equal to 90% in the present specification.The purity of Al₂O₃ is preferably greater than or equal to 99% whichprovides a resistance to damage of the cover panel and a reduction ofcracks or chipping.

In an example embodiment, the cover panel 2 is a panel of a one-layerstructure having a layer made of sapphire which is disposed on thesurface of the electronic apparatus 1. However, the cover panel 2 may bea composite panel (laminated panel) of a multilayer structure havingsuch a layer. For example, the cover panel 2 may be a composite panel ofa two-layered structure configured of a layer (sapphire panel) made ofsapphire which is disposed on the surface of the electronic apparatus 1and a layer (glass panel) made of glass which is attached to the layer.In addition, the cover panel 2 may be a composite panel of athree-layered structure configured of a layer (sapphire panel) made ofsapphire which is disposed on the surface of the electronic apparatus 1,a layer (glass panel) made of glass which is attached to the layer madeof sapphire, and a layer (sapphire panel) made of sapphire which isattached to the layer made of glass. Further, the cover panel 2 mayinclude a layer made of crystalline materials other than sapphire suchas diamond, zirconia, titania, crystal, lithium tantalate, and aluminumoxynitride.

The cover panel 2 includes a transparent and/or light transmissivedisplay portion 2 a (also referred to as a display window) transmittingthe display of the display panel 120. The display portion 2 a has, forexample, a rectangular shape in a plan view. The visible light outputfrom the display panel 120 passes through the display portion 2 a and isemitted to the outside of the electronic apparatus 1. A user visuallyrecognizes information displayed on the display panel 120 through thedisplay portion 2 a from the outside of the electronic apparatus 1.

A portion of a peripheral end 2 b that surrounds the display portion 2 ain the cover panel 2 is opaque and/or not transparent because of, forexample, a film or the like that is attached thereto. Accordingly, theportion of the peripheral end 2 b is a non-display portion that does nottransmit the display of the display panel 120.

The case 3 has an approximately square shape with one surface that ispartially opened. The case 3 of the electronic apparatus 1 includes aperipheral end of a front surface, a side surface, and a rear surface.The case 3 is formed of, for example, at least one of a resin and ametal. The resin forming the case 3 may be, for example, a polycarbonateresin, an acrylonitrile butadiene styrene (ABS) resin, or a nylon-basedresin. A metal forming the case 3 may be, for example, aluminum. Thecase 3 may be configured of only one material or a combination ofmaterials.

As illustrated in FIG. 4, a touch panel 130 is attached to the innersurface 21 of the cover panel 2. The display panel 120 which is adisplay unit is attached to the surface on the opposite side to theinner surface 21 of the touch panel 130. That is, the display panel 120is installed on the inner surface 21 of the cover panel 2 with the touchpanel 130 therebetween. A portion of the cover panel 2 facing thedisplay panel 120 is the display portion 2 a. The user can providevarious instructions with respect to the electronic apparatus 1 byoperating the display portion 2 a of the cover panel 2 using a finger orthe like.

A printed board 260 on which various components such as a CPU 101, a DSP102, and the like described below are mounted is disposed in the insideof the case 3. The printed board 260 is disposed between a rear surface10 side of the electronic apparatus 1 and the display panel 120.

An operation unit 200, described below, and illustrated in FIG. 6,includes an operation button 201 that is disposed in the inside of thecase 3. The surface of the operation button 201 is exposed from thelower end of the outer surface 20 of the cover panel 2. A hole (forexample, a through-hole) 22 that penetrates the cover panel 2 in thethickness direction thereof is configured at the lower end of the coverpanel 2. The hole 22 is configured at the central portion in the lateraldirection in the lower end of the cover panel 2. The operation button201 is exposed from the hole 22. Although one operation button 201 isshown disposed with respect to the operation unit 200, a plurality ofthe operation buttons 201 exposed from the cover panel 2 may beprovided. The operation button 201 may be, for example, glass or resin.Other materials that may be used for the operation button 201 includecrystalline materials such as sapphire, diamond, zirconia, titania,crystal, lithium tantalate, and aluminum oxynitride. Further, theoperation button 201 may not be provided. In this case, the hole 22 isnot necessary in the cover panel 2 and no hole is formed on the coverpanel 2.

As illustrated in FIG. 4 and FIG. 6, a proximity sensor 140, a frontimaging unit 160, a rear imaging unit 170, and a piezoelectric vibratingelement 190 are disposed in the inside of the case 3. As illustrated inFIG. 4, the piezoelectric vibrating element 190 is attached to the innersurface 21 of the cover panel 2 by an attaching member 250. For example,a double-sided tape or an adhesive may be adopted as an attaching member250.

A first transparent portion 40 for visual recognition of the proximitysensor 140 is disposed in the upper end of the cover panel 2. A secondtransparent portion 50 for visual recognition of an imaging lens isincluded in the front imaging unit 160, and is disposed on the upper endof the cover panel 2.

A illustrated in FIG. 3, a third transparent portion 60 for visualrecognition of the imaging lens is included in the rear imaging unit 170is disposed on the rear surface 10 of the electronic apparatus 1.Speaker holes 70 are formed on the rear surface 10 of the electronicapparatus 1.

The cover panel 2 is attached to the case 3 by an attaching member.Specifically, the inner surface 21 of the cover panel 2 is attached tothe case 3 through the attaching member. In this manner, the innersurface 21 of the cover panel 2 is supported by the case 3. A battery210 is in the inside of the case 3.

In FIG. 5, an area attached to the case 3 by the attaching member on theinner surface 21 of the cover panel 2 is indicated by oblique lines. Asillustrated in FIG. 1 and FIG. 5, the case 3 is attached to theperipheral edge on the inner surface 21 of the cover panel 2 such thatthe case 3 surrounds the entire circumference of the display portion 2 aof the cover panel 2. That is, the case 3 supports the peripheral edgeon the inner surface 21 of the cover panel 2 such that the case 3surrounds the circumference of the display portion 2 a of the coverpanel 2.

In the upper end on the inner surface 21 of the cover panel 2, a portionon the upper side (outer side) of the first transparent portion 40 andsecond transparent portion 50 i is attached to the case 3. In the lowerend on the inner surface 21 of the cover panel 2, a large part of thearea on the lower side of the display portion 2 a is attached to thecase 3.

In an example embodiment, as illustrated in FIG. 4, a gap reductionmember 270 is disposed in the inside of the electronic apparatus 1. Thegap reduction member 270 is described below.

<Electrical Configuration of Electronic Apparatus>

FIG. 6 is a block diagram mainly illustrating an electricalconfiguration of the electronic apparatus 1. As illustrated in FIG. 6,the electronic apparatus 1 includes the control unit 100, a wirelesscommunication unit 110, the display panel 120, the touch panel 130, theproximity sensor 140, and a microphone 150. Further, the electronicapparatus 1 includes a front imaging unit 160, a rear imaging unit 170,an external speaker 180, a piezoelectric vibrating element 190, anoperation unit 200, and a battery 210. These elements are accommodatedin the case 3.

The control unit 100 includes a Central Processing Unit (CPU) 101, aDigital Signal Processor (DSP) 102, and a storage unit 103. The controlunit 100 manages the overall operation of the electronic apparatus 1 bycontrolling other elements of the electronic apparatus 1.

The storage unit 103 is a recording medium which is non-transitory andis readable by the control unit 100 (CPU) 101 and Digital SignalProcessor (DSP) 102 such as a Read Only Memory (ROM) and a Random AccessMemory (RAM). A main program, a plurality of application programs, andthe like, which are control programs for controlling the electronicapparatus 1, specifically, for controlling respective elements such asthe wireless communication unit 110, the display panel 120, and thelike, are stored in the storage unit 103. Various functions of thecontrol unit 100 can be realized by the CPU 101 and the DSP 102executing various programs in the storage unit 103.

Further, in addition to the ROM and the RAM, the storage unit 103 mayinclude a non-transitory recording medium, which is readable by acomputer. The storage unit 103 may include a compact hard disk drive anda Solid State Drive (SSD).

The wireless communication unit 110 includes an antenna 111. In thewireless communication unit 110, the antenna 111 receives a signal froma mobile phone different from the electronic apparatus 1, or from acommunication device such as a web server connected to the Internet viaa base station. The wireless communication unit 110 performs anamplification process and down conversion on the received signal andoutputs the signal to the control unit 100. The control unit 100performs demodulation processing or the like on the received signal, andacquires a sound signal (sound information) indicating a voice or musicincluded in the received signal.

Further, the wireless communication unit 110 performs up-converting andthe amplification process on a transmission signal including a soundsignal or the like generated in the control unit 100, and transmits thetransmission signal after the process from the antenna 111 in a wirelessmanner. The transmission signal from the antenna 111 is received in acommunication device connected to the Internet or a mobile phonedifferent from the electronic apparatus 1 via the base station.

The display panel 120 is, for example, a liquid crystal display panel oran organic electro luminescent (EL) panel. The display panel 120displays various pieces of information such as characters, symbols, andfigures by control of the control unit 100. The information displayed inthe display panel 120 can be visually recognized by the user of theelectronic apparatus 1 through the display portion 2 a of the coverpanel 2.

The touch panel 130 is, for example, a projection type electrostaticcapacitance touch panel in a form of a sheet. The touch panel 130detects contact of an object with respect to the display portion 2 a ofthe cover panel 2, and outputs a detection signal according to thedetected contact. The touch panel 130 is attached to the inner surface21 of the cover panel 2. The control unit 100 specifies the contents ofan operation performed on the display portion 2 a of the cover panel 2based on the detection signal output from the touch panel 130, andperforms an operation according to the specified contents.

The proximity sensor 140 is, for example, an infrared type proximitysensor. The proximity sensor 140 outputs a detection signal when anobject approaches the proximity sensor 140 within a predetermineddistance. The detection signal is input to the control unit 100. Whenthe control unit 100 receives the detection signal from the proximitysensor 140, for example, the control unit 100 stops a function ofdetecting an operation of the touch panel 130.

The front imaging unit 160 includes an imaging lens, an imaging element,and the like. The front imaging unit 160 images a still image and amoving image based on the control by the control unit 100. The imaginglens of the front imaging unit 160 can be visually recognized from thesecond transparent portion 50 on the front surface of the electronicapparatus 1. Therefore, the front imaging unit 160 can image an objectin front of the surface side (cover panel 2 side) of the electronicapparatus 1.

The rear surface imaging unit 170 includes an imaging lens, an imagingelement, and the like. The rear imaging unit 170 images a still imageand a moving image based on the control by the control unit 100. Theimaging lens of the rear imaging unit 170 can be recognized from thethird transparent portion 60 on the rear surface of the electronicapparatus 1. Therefore, the rear surface 10 side imaging unit 170 canimage an object in front of the rear surface 10 side of the electronicapparatus 1.

The microphone 150 outputs a sound from the outside of the electronicapparatus 1 to the control unit 100 by converting the sound into anelectric sound signal. The sound from the outside of the electronicapparatus 1 is received by the microphone 150 through microphone holes(not illustrated) configured on the surface of the electronic apparatus1.

The external speaker 180 is, for example, a dynamic speaker. Theexternal speaker 180 converts the electric sound signal from the controlunit 100 into a sound and then outputs the sound. The sound output fromthe external speaker 180 is output from the speaker holes 70 configuredon the rear surface 10 of the electronic apparatus 1. The volume of thesound output from the speaker holes 70 is set to a degree such that thesound can be heard at a location separated from the electronic apparatus1.

As illustrated in FIG. 4 and FIG. 6, the piezoelectric vibrating element190 is attached to the inner surface 21 of the cover panel 2 disposed onthe front surface of the electronic apparatus 1 by an attaching member250 as described above. The piezoelectric vibrating element 190 isvibrated by a driving voltage applied from the control unit 100. Thecontrol unit 100 generates a driving voltage based on a sound signal andapplies the driving voltage to the piezoelectric vibrating element 190.The cover panel 2 is vibrated by the piezoelectric vibrating element 190which vibrates based on the driving voltage form the control unit 100.As a result, a reception sound is transmitted to the user from the coverpanel 2. The volume of the reception sound is set to a degree such thatthe user can appropriately hear the sound when the cover panel 2 is setclose against an ear of the user.

The operation unit 200 includes an operation button 201 and a switch anddetects an operation with respect to the operation button 201. Theswitch turns on when the operation button 201 is pressed (operated). Theoperation unit 200 outputs an ON signal, indicating that the operationbutton 201 is operated, to the control unit 100 when the switch isturned on. In contrast, the operation unit 200 outputs an OFF signal,indicating that the operation button 201 is not operated, to the controlunit 100 when the operation button 201 has not operated for apredetermined time and the switch is turned OFF. The control unit 100determines whether the operation button 201 is operated or not based onthe ON signal and the OFF signal input from the operation unit 200, andperforms an operation according to the determination result.

The battery 210 outputs a power source for use by the electronicapparatus 1. The power source output from the battery 210 is supplied torespective electronic components contained in the control unit 100 orthe wireless communication unit 110 included in the electronic apparatus1.

<Details of Piezoelectric Vibrating Element>

FIGS. 7 and 8 illustrate a top view and a side view, respectively, of astructure of the piezoelectric vibrating element 190. As illustrated inFIGS. 7 and 8, the piezoelectric vibrating element 190 has a long shapein one direction. Specifically, the piezoelectric vibrating element 190has a long and narrow rectangular plate shape in a plan view. Thepiezoelectric vibrating element 190 has, for example, a bimorphstructure. The piezoelectric vibrating element 190 includes a firstpiezoelectric ceramic plate 190 a and a second piezoelectric ceramicplate 190 b which are bonded to each other through a shim material 190c.

In the piezoelectric vibrating element 190, when a positive voltage isapplied to the first piezoelectric ceramic plate 190 a and a negativevoltage is applied to the second piezoelectric ceramic plate 190 b, thefirst piezoelectric ceramic plate 190 a extends along the longitudinaldirection and the second piezoelectric ceramic plate 190 b contractsalong the longitudinal direction. Accordingly, as illustrated in FIG. 9,the piezoelectric vibrating element 190 is bent into a convex shape withthe first piezoelectric ceramic plate 190 a being outside.

In contrast, in the piezoelectric vibrating element 190, when a negativevoltage is applied to the first piezoelectric ceramic plate 190 a and apositive voltage is applied to the second piezoelectric ceramic plate190 b, the first piezoelectric ceramic plate 190 a contracts along thelongitudinal direction and the second piezoelectric ceramic plate 190 bextends along the longitudinal direction. Accordingly, as illustrated inFIG. 10, the piezoelectric vibrating element 190 is bent into a convexshape with the second piezoelectric ceramic plate 190 b being outside.

The piezoelectric vibrating element 190 vibrates while being bent alongthe longitudinal direction by alternatively taking the state of FIG. 9and FIG. 10. The control unit 100 allows the piezoelectric vibratingelement 190 to vibrate while being bent along the longitudinal directionby applying an alternating current (AC) voltage in which the positivevoltage and the negative voltage alternatively appear at an area betweenthe first piezoelectric ceramic plate 190 a and the second piezoelectricceramic plate 190 b.

Only one structure made of the first piezoelectric ceramic plate 190 aand the second piezoelectric ceramic plate 190 b, which are bonded toeach other by interposing the shim material 190 c therebetween, isprovided in the piezoelectric vibrating element 190 illustrated in FIGS.7 to 10. However, a plurality of the structures may be laminated to eachother.

The piezoelectric vibrating element 190 having such a structure isdisposed on the peripheral end of the inner surface 21 of the coverpanel 2, as illustrated in FIG. 5. Specifically, the piezoelectricvibrating element 190 is disposed in a central portion in a short-lengthdirection DR2 in the upper end of the inner surface 21 of the coverpanel 2. The longitudinal direction of the piezoelectric vibratingelement 190 is disposed along the short-length direction DR2 of thecover panel 2. In this manner, the piezoelectric vibrating element 190vibrates while being bent along the short-length direction DR2 of thecover panel 2. Further, the center of the longitudinal direction of thepiezoelectric vibrating element 190 corresponds to the center of theshort-length direction DR2 in the upper end of the inner surface 21 ofthe cover panel 2.

As illustrated in FIGS. 9 and 10, the center of the longitudinaldirection of the piezoelectric vibrating element 190 has the largestdisplacement amount when the piezoelectric vibrating element 190 isvibrating. Accordingly, an area in the center of the short-lengthdirection DR2 in the upper end of the inner surface 21 of the coverpanel 2, that corresponds to the position of the piezoelectric vibratingelement, has the largest displacement amount of bending and vibrating.

As illustrated in FIG. 5, a partial area 220 in the upper end of thecover panel 2, on which the front surface side of the case 3 and thedisplay panel 120 are not mounted, has a long shape along theshort-length direction DR2 of the cover panel 2. Therefore, the partialarea 220 is easily bent along the short-length direction DR2 compared tothe longitudinal direction DR1 because of the shape thereof. Since thelongitudinal direction (direction of the piezoelectric vibrating elementvibrating while being bent) of the piezoelectric vibrating element 190is disposed in the partial area 220 along the longitudinal direction ofthe partial area 220, the partial area 220 easily vibrates. Therefore,the reception sound becomes easily transmitted to the user from thecover panel 2.

As illustrated in FIG. 7 to FIG. 10, only one structure made of thefirst piezoelectric ceramic plate 190 a and the second piezoelectricceramic plate 190 b, which are bonded to each other by interposing theshim material 190 c therebetween, is provided in the piezoelectricvibrating element 190. However, a plurality of the structures may belaminated to each other. For example, twenty-eight or more layers thatare laminated provide an increased level of vibration that can betransmitted to the cover panel 2. Accordingly forty-four or more layersthat are laminated provide an increased sufficiency in the vibrationthat can be transmitted to the cover panel 2.

Further, the piezoelectric vibrating element 190 may be made of organicpiezoelectric materials such as polyvinylidene fluoride and polylacticacid in addition to the piezoelectric ceramic materials. For example,the piezoelectric vibrating element 190 is configured such that filmsmade of polylactic acid are used as a first piezoelectric plate and asecond piezoelectric plate and they are laminated to each other. Inaddition, in regard to an electrode, a transparent electrode such asIndium-Tin-Oxide (that is, indium tin oxide, ITO) is possible to beused.

<Regarding Generation of Reception Sound>

In the electronic apparatus 1, an air conduction sound and a conductionsound are transmitted to the user by the piezoelectric vibrating element190 through the cover panel 2 which is vibrated by the piezoelectricvibrating element 190. That is, the vibration of the piezoelectricvibrating element 190 is transmitted to the cover panel 2 so that theair conduction sound and the conduction sound are transmitted to theuser from the cover panel 2.

Here, the term “air conduction sound” means a sound recognized in ahuman brain by the vibration of an eardrum due to a sound wave (airvibration) which enters an external auditory meatus hole (a so-called“ear hole”). On the other hand, the term “conduction sound” is a soundrecognized in a human brain by the vibration of the eardrum due to thevibration of an auricle transmitted to the eardrum. Hereinafter, the airconduction sound and the conduction sound will be described in detail.

FIG. 11 is a view for describing the air conduction sound and theconduction sound. FIG. 11 illustrates a structure of an ear of the userof the electronic apparatus 1. In FIG. 11, a dotted line 400 indicates aconduction path of a sound signal (sound information) of the airconduction sound. A solid line 410 indicates the conduction path of thesound signal of the conduction sound.

When the piezoelectric vibrating element 190 mounted on the cover panel2 vibrates based on the electric sound signal indicating the receptionsound, the cover panel 2 vibrates, and a sound wave is output from thecover panel 2. When the user moves the cover panel 2 of the electronicapparatus 1 close to an auricle 300 of the user by holding theelectronic apparatus 1 in a hand, or the cover panel 2 of the electronicapparatus 1 is set to (brought into contact with) the auricle 300 of theuser, the sound wave output from the cover panel 2 enters an externalauditory meatus hole 310. The sound wave from the cover panel 2 entersin the external auditory meatus hole 310 and the eardrum 320, and theeardrum 320 vibrates. The vibration of the eardrum 320 is transmitted toan auditory ossicle 330 and the auditory ossicle 330 vibrates. Inaddition, the vibration of the auditory ossicle 330 is transmitted to acochlea 340 and is converted into an electrical signal in the cochlea340. The electrical signal is transmitted to the brain by passingthrough an acoustic nerve 350 and the reception sound is recognized inthe brain. In this manner, the air conduction sound is transmitted fromthe cover panel 2 to the user.

Further, when the user puts the cover panel 2 of the electronicapparatus 1 to the auricle 300 of the user by holding the electronicapparatus 1 in a hand, the auricle 300 is vibrated by the cover panel 2,which cover panel 2 is vibrated by the piezoelectric vibrating element190. The vibration of the auricle 300 is transmitted to the eardrum 320,and thus the eardrum 320 vibrates. The vibration of the eardrum 320 istransmitted to the auditory ossicle 330, and thus the auditory ossicle330 vibrates. The vibration of the auditory ossicle 330 is transmittedto the cochlea 340 and is converted into an electrical signal in thecochlea 340. The electrical signal is transmitted to the brain bypassing through the acoustic nerve 350 and the reception sound isrecognized in the brain. In this manner, the conduction sound istransmitted from the cover panel 2 to the user. FIG. 11 illustrates anauricular cartilage 300 a in the inside of the auricle 300.

Bone conduction sound is a sound recognized in a human brain by thevibration of the skull and direct stimulation of the inner ear such asthe cochlea caused by the vibration of the skull. In FIG. 11, in a caseof vibrating the jawbone 500, the transmission path of the sound signalwhile the bone conduction sound is recognized in the brain is indicatedwith a plurality of arcs 420.

As described above, the air conduction sound and the conduction soundcan be transmitted from the cover panel 2 to the user of the electronicapparatus 1 due to the vibration of the cover panel 2 through thevibration of the piezoelectric vibrating element 190. The user can hearthe air conduction sound from the cover panel 2 by moving the coverpanel 2 close to an ear (auricle). Further, the user can hear the airconduction sound and the conduction sound from the cover panel 2 bybringing the cover panel 2 into contact with an ear (auricle).

Since the user can hear a sound when the user puts the cover panel 2 toan ear, communication using the electronic apparatus 1 can be performedwithout much concerning regarding the position of the electronicapparatus 1 with respect to the ear.

In addition, since the user can hear the conduction sound due to thevibration of the auricle, it easy for the user to hear the sound evenwhen there is a large amount of ambient noise. Accordingly, the user canappropriately perform communication even when there is a large amount ofthe ambient noise.

In addition, even in a state in which earplugs or earphones are fixed tothe ears of the user, the reception sound from the electronic apparatus1 can be recognized by setting the cover panel 2 to the auricle.Further, even in the state in which headphones are fixed to the ears ofthe user, the reception sound from the electronic apparatus 1 can berecognized by putting the cover panel 2 to the headphones.

The sound from the cover panel 2 becomes easy to hear when the usermoves the upper end of the cover panel 2 (particularly, the centralportion of the upper end in the short-length direction DR2 whichcorresponds to the placement of the piezoelectric vibrating element 190)close to an ear, or puts the upper end thereof to an ear.

In another example, a general dynamic receiver may be provided insteadof or in addition to the piezoelectric vibrating element 190.

<Gap Reduction Member>

In FIG. 4, the printed board 260 includes a board 262 and a plurality ofcomponents 264. The board 262 has a plate shape, and the board 262 isdisposed in an area (that is, the inner surface 21 side area of thecover panel 2) facing the cover panel 2. More specifically, the board262 is disposed so as to face the display panel 120, that is, the board262 faces the cover panel 2 through the display panel 120 and the touchpanel 130. The plurality of components 264 includes various electroniccomponents (for example, a resistor, a switch element, or semiconductormodule exhibiting a specific function such as the control unit 100),components for protecting, shielding, or fixing these electroniccomponents, or one or more connectors which electrically connect anexternal memory or the like to the board 262. These plurality ofcomponents 264 are disposed on the board 262. In FIG. 4, the pluralityof components 264 are disposed on the display panel 120 side of theboard 262. Several components 264 have heights (heights in the directionperpendicular to the surface of the board 262) different from oneanother.

The gap reduction member 270 is a different body from the case 3, and isdisposed so as to face the printed board 260 from the plurality ofcomponents 264 side. That is, the gap reduction member 270 faces theplurality of components 264 through a space. The gap reduction member270 has an approximate plate shape and steps are formed on a facingsurface (surface on the printed board 260 side) 272 which faces thecomponents 264. The steps are formed according to the heights of theplurality of components 264. In FIG. 4, the facing surface 272 of thegap reduction member 270 includes a first surface 272 a facing arelatively low component 264 (component having the relatively lowheight) and a second surface 272 b facing a relatively high component264 (component having the relatively high height). The first surface 272a is positioned closer to the printed board 260 side than the secondsurface 272 b. The first surface 272 a is connected with the secondsurface 272 b by forming steps.

In FIG. 4, the first surface 272 a is positioned on the board 262 sidemore than the top surface of the relatively high component 264.Accordingly, the gap between the relatively low component 264 and thegap reduction member 270 (more specifically, a facing surface 272) isfurther decreased.

The material of the gap reduction member 270 is not limited as long asthe material is a solid, and, for example, a resin or a metal (forexample, aluminum) can be adopted. The gap reduction member 270 is fixedto the electronic apparatus 1 (for example, to the case 3).

It is possible to reduce breakage of the cover panel 2 as describedbelow according to the gap reduction member 270. An example of pressingthe cover panel 2 to the rear surface 10 side is considered. Here, thecover panel 2 is pressed at a position in which the gap reduction member270 is disposed in a plan view. In this example, the cover panel 2, thetouch panel 130, and the display panel 120 are approximately integrallydisplaced to the rear surface 10 side in the pressed portion. Inaddition, when the displacement amount is increased, the display panel120 presses the gap reduction member 270. Since the gap reduction member270 presses back the display panel 120 by the action or the reactionthereof, displacement of the cover panel 2 can be reduced. Accordingly,the displacement of the cover panel 2 can be reduced when compared tothe structure in which the gap reduction member 270 is not provided.Further, the breakage of the cover panel 2 can be reduced.

In addition, when a pressing force with respect to the cover panel 2 islarge, the gap reduction member 270 is displaced towards the printedboard 260 side and is brought into contact with the printed board 260.In this manner, the gap reduction member 270 presses the printed board260. The printed board 260 presses back the gap reduction member 270 tothe cover panel 2 side by the action or the reaction thereof.

Further, the facing surface 272 of the gap reduction member 270 hassteps according to the heights of the components 264. Accordingly, forexample, the gap between the gap reduction member 270 and the relativelylow component 264 can be reduced when compared to another printed board(not shown) where the facing surface 272 of the gap reduction member 270has an approximately planar shape without having steps. When the coverpanel 2 is pressed in the position where the relatively low component264 is disposed, the gap reduction member 270 is brought into contactwith the printed board 260 with smaller displacement. Therefore, thedisplacement of the cover panel 2 can be effectively reduced whencompared to another printed board (not shown) where the surface of thegap reduction member 270 has an approximately planar shape, and thebreakage of the cover panel 2 can be effectively reduced.

Further, the steps in accordance with the heights of the components 264herein are not necessarily steps in accordance with each height of everycomponent 264. That is, in an example printed board, steps in accordancewith a group of relatively high heights and a group of relatively lowheights among the components 264 may be formed. In another exampleprinted board, steps in accordance with each height of every component264 may be formed.

In FIG. 4, the surface 274 of the gap reduction member 270 on theopposite side of the facing surface 272 has an approximately planarshape along the display panel 120. That is, the surface 274 has a shapecorresponding to the surface of the member (display panel 120) whichfaces and is adjacent to the surface 274. In this manner, the thicknessof the gap reduction member 270 (thickness in a direction perpendicularto the board 262) varies so that the gap reduction member 270 becomesmore difficult to be displaced in the thickness direction. Therefore,the displacement of the cover panel 2 can be further reduced and thebreakage of the cover panel 2 can be further reduced.

In addition, in the above-described embodiment, the components 264 aredisposed on the surface on the display panel 120 side of the board 262,but may be disposed on the surface on the opposite side to the displaypanel 120 as illustrated in FIG. 12. Even in this example, the gapreduction member 270 is disposed so as to face the printed board 260from the components 264 side. That is, the gap reduction member 270 isdisposed between the printed board 260 and the case 3 (morespecifically, a portion forming the rear surface 10), and directly facesthe components 264.

In this example, when a portion of the rear surface 10 side of the case3 is pressed, the displacement of the case 3 can be reduced by themechanism which is the same as that in FIG. 4. Consequently, even if theportion of the rear surface 10 side of the case 3 is formed of amaterial having high hardness (for example, sapphire, diamond, zirconia,titania, crystal, lithium tantalate, or aluminum oxynitride), thebreakage of the case 3 can be reduced.

Alternatively, the displacement of the cover panel 2 can be reduced aswell. When the cover panel 2 is pressed, the display panel 120 isbrought into contact with the printed board 260, and presses to theprinted board 260. Since the printed board 260 presses back the displaypanel 120 by the mechanism or the reaction thereof, more displacement ofthe cover panel 2 is reduced. When a pressing force of the cover panel 2is large and the printed board 260 is more displaced, the printed board260 presses the gap reduction member 270 while being in contact with thegap reduction member 270. Since the gap reduction member 270 pressesback the printed board 260 by the action or the reaction thereof, moredisplacement of the cover panel 2 is reduced.

In addition, in FIG. 12, the facing surface 272 of the gap reductionmember 270 has steps in accordance with the heights of the components264. Therefore, the printed board 260 is brought into contact with thegap reduction member 270 with less displacement even when the printedboard 260 is displaced to the gap reduction member 270 side in theportion facing the relatively low component 264. Consequently, theprinted board 260 and the gap reduction member 270 press back the coverpanel 2 so that the displacement can be effectively reduced. In thismanner, the breakage of the cover panel 2 can be effectively reduced.

In the above-described examples, the components 264 are disposed on onesurface of the board 262, but the components 264 may be disposed on bothsurfaces. In this example (not shown), the above-described two gapreduction members 270 may be disposed adjacent first and second surfacesof the board 260. The printed board 260 is interposed by these two gapreduction members 270. Alternatively, only one gap reduction member 270may be disposed on one of the two surfaces. A configuration in whichboth of the two gap reduction members 270 are disposed adjacent thefirst and second surfaces of the board can reduce the displacement ofthe cover panel 2. In a modified example (not shown), the gap reductionmember 270 may extend beyond the printed board 260 to provide supportfor the sapphire panel in areas of the housing where gaps are formedbetween components.

FIG. 13 is a plan view schematically illustrating an example of theinternal structure of an electronic apparatus 1, and is a view of theelectronic apparatus 1 when seen from the rear surface 10 side. Forexample, the printed board 260 has a long shape along the longitudinaldirection of the electronic apparatus 1, and the battery 210 has a longshape along the longitudinal direction of the electronic apparatus 1.The printed board 260 and the battery 210 are disposed so as to beadjacent to each other in the short-length direction. Further, avibrator 730 that performs notification with respect to the user, and aheadphone port 740 to which an external headphone is connected, areillustrated in FIG. 13. In addition, other members (for example, variousdevices described in FIG. 6) may be disposed, although the illustrationomits these various devices for easy understanding.

In FIG. 13, the gap reduction member 270 is disposed on the rear surface10 side. The gap reduction member 270 is fixed to the electronicapparatus 1 by, for example, a spring 720 or the like. In this manner,the strength of the entire electronic apparatus 1 can be improved.

FIG. 14 is a cross-sectional view illustrating an embodiment of theinternal structure of the electronic apparatus 1. In FIG. 14, the gapreduction member 270 is disposed on the printed board 260 in the coverpanel 2 side. In an example illustrated in FIG. 14, the battery 210 isadjacent to the printed board 260 in the direction parallel to the board262, (and is disposed in an area facing the cover panel 2. Further, thebattery 210 has height greater than that of the printed board 260.Accordingly, when the gap reduction member 270 is not disposed in theelectronic apparatus 1, there is a difference between heights (steps) ofthe battery 210 and the printed board 260. However, as shown in FIG. 14,the gap reduction member 270 fills a space formed due to this heightdifference. Accordingly, the breakage of the cover panel 2 iseffectively reduced.

In the example illustrated in FIG. 14, the surface of the battery 210 onthe rear surface 10 side is positioned with the same height as that ofthe surface on the printed board 260 on the rear surface 10 side.Accordingly, the space between the cover panel 2 and the case 3 (portionon the rear surface 10 side) can be effectively reduced so that thebreakage of the cover panel 2 can be effectively reduced.

Wif the printed board 260 is disposed on the cover panel 2 side morethan the gap reduction member 270 as illustrated in FIG. 12, the rearsurface 10 side surface of the battery 210 may be positioned with thesame plane as the rear surface 10 side surface of the gap reductionmember 270 as illustrated in FIG. 15.

The gap reduction member 270, in an example of the electronic apparatus,is formed of a conductor (for example, a metal, more specificallyaluminum or the like), and the gap reduction member 270 is electricallyconnected to the ground. That is, a current generated in the gapreduction member 270 by the operation (for example, an operation of thecontrol unit 100) of the printed board 260 can be sent to the ground.Accordingly, the operation of the printed board 260 can be stabilized.The electric connection between the gap reduction member 270 and theground may be performed by an arbitrary technique. For example, asillustrated in FIG. 13, a member 710 is electrically connected to theconductive case 3, which is electrically connected to the ground. Thegap reduction member 270 is in contact with and fixed to (co-fastenedto) the member 710 in the spring 720. In addition, when a grounded boardis provided in the electronic apparatus 1, the member 710 may beconnected to the grounded board. Further, the member 710 may beconnected to a ground pattern disposed in the printed board 260.Furthermore, the gap reduction member 270 may be directly connected tothe conductive case 3 which is electrically connected to the ground, thegrounded board, or the ground pattern of the printed board 260.

In addition, the gap reduction member 270 may be formed of a material(for example, a metal, more specifically aluminum or the like) having aheat transfer coefficient greater than that of the air. In this manner,the heat generated in the printed board 260 can be dissipated ordispersed. Therefore, increase in temperature of the printed board 260(more specifically, an electronic component constituting, for example,the control unit 100) can be reduced. In one example, to enhance heattransfer, the surface 274 of the gap reduction member 270 may include,for example, fin-like structures or the like for providing increasedheat sink properties, such that gaps between the fin-like structures aresufficiently small as to not reduce support of the panel 2.

Further, the area between the gap reduction member 270 and thecomponents 264 may be coated with a high heat transfer resin having ahigh heat transfer coefficient. In this manner, the heat from thecomponents 264 can be more effectively transferred to the gap reductionmember 270. Therefore, increase in temperature of the printed board 260(or components 264) can be effectively reduced.

The above-described examples are applied to a mobile phone. However, theexample cover panels 2 and gap reduction members can be applied to anelectronic apparatus other than a mobile phone such as a smart phone, atablet terminal and a wearable type electronic apparatus mounting on anarm, digital books, digital cameras, electronic game machines, digitalmusic players, personal digital assistance (PDA), personal handy phonesystem (PHS), lap top computers, portable TV's, Global PositioningSystems (GPS's) or navigation systems, machining tools, pedometers,health equipment such as weight scales, display monitors, wristwatch,and the like.

As described above, the electronic apparatus 1 has been described indetail, but the above description is merely an example in every aspectand the present invention is not limited thereto. Further, variousmodifications described above can be applied in combination as long asthey do not contradict each other. In addition, it is understood thatnumerous modifications which are not exemplified above can be assumedwithout departing from the scope of the present invention. For example,as at least a part of the materials of the case 3, sapphire, diamond,zirconia, titania, crystal, lithium tantalate, or aluminum oxynitridemay be adopted in the same manner as that of the cover panel 2.

What is claimed is:
 1. An electronic apparatus, comprising: a case; asapphire panel that includes an outer surface facing outwards from thecase, and an inner surface, the case and the sapphire panel forming ahousing; a board that is disposed in the case; a plurality of componentsthat are disposed on the board, the plurality of components having aplurality of heights; and a gap reduction member comprising a pluralityof steps that are disposed so as to face the plurality of components,the plurality of steps having heights corresponding to the heights ofthe plurality of components, wherein the gap reduction member isdisposed in a space between the sapphire panel and the board, the spaceformed in part due to a difference between the heights of the pluralityof components in a direction perpendicular to the board.
 2. Theelectronic apparatus according to claim 1, wherein the gap reductionmember has a heat transfer coefficient greater than the heat transfercoefficient of the air.
 3. The electronic apparatus according to claim1, wherein the gap reduction member has electric conductivity and iselectrically connected to a ground level.
 4. The electronic apparatusaccording to claim 1, wherein the plurality of components are disposedon the surface of the board on a panel side that faces the sapphirepanel, and the gap reduction member is disposed between the sapphirepanel and the board.
 5. The electronic apparatus according to claim 1,further comprising: a battery that is disposed to be adjacent to theboard.
 6. The electronic apparatus according to claim 1, wherein theplurality of components are disposed on a top surface of the board andon a rear surface of the board, wherein the gap reduction membercomprises a first gap reduction member disposed between the sapphirepanel and the board, and a second gap reduction member disposed betweenthe board and a rear surface of the case.
 7. The electronic apparatusaccording to claim 1, wherein a top surface of the gap reduction membercomprises members to provide a heat sink for the board.
 8. Theelectronic apparatus according to claim 1, wherein the gap reductionmember extends beyond the board to provide support to the sapphire panelin areas of the housing that have gaps between components.
 9. Theelectronic device of claim 1, wherein the gap reduction member extendsbeyond the circuit board to provide support to the sapphire panel inareas of the housing that have gaps between components.
 10. Anelectronic device comprising: a housing; a sapphire panel on a topsurface of the housing; a circuit board within the housing comprising aplurality of components with varying heights; a gap reduction memberdisposed between the sapphire panel and the circuit board and having afirst surface to match the varying heights of the plurality ofcomponents, wherein the gap reduction member is disposed in a spacebetween the sapphire panel and the circuit board, the space formed inpart due to a difference between the heights of the plurality ofcomponents in a direction perpendicular to the circuit board.
 11. Theelectronic device of claim 10, wherein the gap reduction member has aheat transfer coefficient greater than the heat transfer coefficient ofthe air.
 12. The electronic device of claim 10, wherein the gapreduction member has electric conductivity and is electrically connectedto a ground level.
 13. The electronic device of claim 10, wherein theplurality of components of the circuit board are on a panel side thatfaces the sapphire panel, and the gap reduction member is disposedbetween the sapphire panel and the circuit board.
 14. The electronicdevice of claim 10, further comprising: a battery that is adjacent tothe circuit board.
 15. The electronic device of claim 10, wherein theplurality of components are disposed on a top surface of the circuitboard and on a rear surface of the circuit board, wherein the gapreduction member comprises a first gap reduction member disposed betweenthe sapphire panel and the circuit board, and a second gap reductionmember disposed between the circuit board and a rear surface of thehousing.
 16. The electronic device of claim 10, wherein a top surface ofthe gap reduction member comprises members to provide a heat sink forthe circuit board.